Topics in Millimeter Wave Technology by Kenneth J. Button

By Kenneth J. Button

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80) substrate. , 1983). 5 millisec­ onds (Solbach, 1983) without damage. But the use of a hard substrate makes the tolerance requirements critical to prevent breaking of the sub­ strate under clamping forces. IV. Discontinuities in Fin-Lines In fin-line circuits, junctions or discontinuities are often introduced so that appropriate circuit functions may be performed. Some typical discon­ tinuities are shown in Fig. 21. They include (a) steps in slot width, (b) a small capacitive strip and (c) an inductive notch.

This can be avoided either by milling a choke-slot in the waveguide block or by using a serration in the metalliza­ tion pattern of the circuit board. 48 PRAKASH BHARTIA AND PROTAP PRAMANICK Nylon Screw Substrate Insulating Gasket -Printed Fin zi / Housing w c-JUa- (a) a Metal Gasket Split Block Clamping Region Split Block Meeting Surface (D' Waveguide Circuit Board FIG. 20 (a) The fin-line housing. (Meier. 1974, Reprinted from IEEE Trans. , Vol. 22, No. 12, pp. 1209-1216. ) (b) Fin-line housing.

The connections are fed through the clamping region, or a strip of the circuit board is allowed to penetrate into the waveguide block to make such connections as shown in Fig. 20c. Inspite of its two disadvantages it is preferred because of the compact size. The purpose of the dielectric substrate in a fin-line is to support the metallic fin so that the photo etching technique may be used to render the fin-gap pattern for a desired circuit operation. Therefore the substrate should be as thin as possible, and its dielectric constant should have the lowest possible value.

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